added pot direction solder jumpers; added MOSFET heat sink mounting holes

This commit is contained in:
cyber-murmel
2022-09-23 17:53:40 +02:00
parent 94f04b5ab3
commit f95e4ff334
20 changed files with 11350 additions and 9689 deletions

View File

@ -1,11 +1,115 @@
** Drc report for /home/marble/wtf/2022019/Alternator_Motor_Driver/source/Alternator_Motor_Driver.kicad_pcb **
** Created on 2022-09-23 14:19:05 **
** Created on 2022-09-23 17:47:25 **
** Found 1 DRC violations **
** Found 27 DRC violations **
[courtyards_overlap]: Courtyards overlap
Local override; Severity: error
@(170,1800 mm, 109,2200 mm): Footprint H2
@(165,1000 mm, 106,6800 mm): Footprint R4
@(160,0200 mm, 81,2800 mm): Footprint H3
@(157,4800 mm, 86,3600 mm): Footprint Q3
[courtyards_overlap]: Courtyards overlap
Local override; Severity: error
@(144,7800 mm, 81,2800 mm): Footprint H2
@(142,2400 mm, 86,3600 mm): Footprint Q2
[courtyards_overlap]: Courtyards overlap
Local override; Severity: error
@(127,0000 mm, 86,3600 mm): Footprint Q1
@(129,5400 mm, 81,2800 mm): Footprint H1
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(158,1700 mm, 83,0900 mm): Line on F.Silkscreen
@(160,0200 mm, 81,2800 mm): Through hole pad 1 [W] of H3
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(158,1700 mm, 83,0900 mm): Line on F.Silkscreen
@(158,1638 mm, 83,1362 mm): Through hole pad 1 [W] of H3
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(139,6600 mm, 84,6000 mm): Line on F.Silkscreen
@(144,7800 mm, 81,2800 mm): Through hole pad 1 [V] of H2
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(139,6600 mm, 83,0900 mm): Line on F.Silkscreen
@(144,7800 mm, 81,2800 mm): Through hole pad 1 [V] of H2
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(139,6600 mm, 83,0900 mm): Line on F.Silkscreen
@(142,9238 mm, 83,1362 mm): Through hole pad 1 [V] of H2
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(139,6600 mm, 83,0900 mm): Line on F.Silkscreen
@(146,6362 mm, 83,1362 mm): Through hole pad 1 [V] of H2
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(142,9300 mm, 83,0900 mm): Line on F.Silkscreen
@(144,7800 mm, 81,2800 mm): Through hole pad 1 [V] of H2
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(142,9300 mm, 83,0900 mm): Line on F.Silkscreen
@(142,9238 mm, 83,1362 mm): Through hole pad 1 [V] of H2
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(146,6310 mm, 83,0900 mm): Line on F.Silkscreen
@(144,7800 mm, 81,2800 mm): Through hole pad 1 [V] of H2
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(146,6310 mm, 83,0900 mm): Line on F.Silkscreen
@(146,6362 mm, 83,1362 mm): Through hole pad 1 [V] of H2
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(124,4200 mm, 84,6000 mm): Line on F.Silkscreen
@(129,5400 mm, 81,2800 mm): Through hole pad 1 [U] of H1
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(127,6900 mm, 83,0900 mm): Line on F.Silkscreen
@(129,5400 mm, 81,2800 mm): Through hole pad 1 [U] of H1
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(127,6900 mm, 83,0900 mm): Line on F.Silkscreen
@(127,6838 mm, 83,1362 mm): Through hole pad 1 [U] of H1
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(131,3910 mm, 83,0900 mm): Line on F.Silkscreen
@(129,5400 mm, 81,2800 mm): Through hole pad 1 [U] of H1
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(131,3910 mm, 83,0900 mm): Line on F.Silkscreen
@(131,3962 mm, 83,1362 mm): Through hole pad 1 [U] of H1
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(124,4200 mm, 83,0900 mm): Line on F.Silkscreen
@(129,5400 mm, 81,2800 mm): Through hole pad 1 [U] of H1
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(124,4200 mm, 83,0900 mm): Line on F.Silkscreen
@(127,6838 mm, 83,1362 mm): Through hole pad 1 [U] of H1
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(124,4200 mm, 83,0900 mm): Line on F.Silkscreen
@(131,3962 mm, 83,1362 mm): Through hole pad 1 [U] of H1
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(154,9000 mm, 83,0900 mm): Line on F.Silkscreen
@(161,8762 mm, 83,1362 mm): Through hole pad 1 [W] of H3
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(154,9000 mm, 83,0900 mm): Line on F.Silkscreen
@(160,0200 mm, 81,2800 mm): Through hole pad 1 [W] of H3
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(154,9000 mm, 83,0900 mm): Line on F.Silkscreen
@(158,1638 mm, 83,1362 mm): Through hole pad 1 [W] of H3
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(154,9000 mm, 84,6000 mm): Line on F.Silkscreen
@(160,0200 mm, 81,2800 mm): Through hole pad 1 [W] of H3
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(161,8710 mm, 83,0900 mm): Line on F.Silkscreen
@(161,8762 mm, 83,1362 mm): Through hole pad 1 [W] of H3
[silk_over_copper]: Silkscreen clipped by solder mask
Rule: board setup constraints silk; Severity: warning
@(161,8710 mm, 83,0900 mm): Line on F.Silkscreen
@(160,0200 mm, 81,2800 mm): Through hole pad 1 [W] of H3
** Found 0 unconnected pads **

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