added pot direction solder jumpers; added MOSFET heat sink mounting holes
This commit is contained in:
@ -1,11 +1,115 @@
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** Drc report for /home/marble/wtf/2022019/Alternator_Motor_Driver/source/Alternator_Motor_Driver.kicad_pcb **
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** Created on 2022-09-23 14:19:05 **
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** Created on 2022-09-23 17:47:25 **
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** Found 1 DRC violations **
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** Found 27 DRC violations **
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[courtyards_overlap]: Courtyards overlap
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Local override; Severity: error
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@(170,1800 mm, 109,2200 mm): Footprint H2
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@(165,1000 mm, 106,6800 mm): Footprint R4
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@(160,0200 mm, 81,2800 mm): Footprint H3
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@(157,4800 mm, 86,3600 mm): Footprint Q3
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[courtyards_overlap]: Courtyards overlap
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Local override; Severity: error
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@(144,7800 mm, 81,2800 mm): Footprint H2
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@(142,2400 mm, 86,3600 mm): Footprint Q2
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[courtyards_overlap]: Courtyards overlap
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Local override; Severity: error
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@(127,0000 mm, 86,3600 mm): Footprint Q1
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@(129,5400 mm, 81,2800 mm): Footprint H1
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(158,1700 mm, 83,0900 mm): Line on F.Silkscreen
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@(160,0200 mm, 81,2800 mm): Through hole pad 1 [W] of H3
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(158,1700 mm, 83,0900 mm): Line on F.Silkscreen
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@(158,1638 mm, 83,1362 mm): Through hole pad 1 [W] of H3
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(139,6600 mm, 84,6000 mm): Line on F.Silkscreen
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@(144,7800 mm, 81,2800 mm): Through hole pad 1 [V] of H2
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(139,6600 mm, 83,0900 mm): Line on F.Silkscreen
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@(144,7800 mm, 81,2800 mm): Through hole pad 1 [V] of H2
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(139,6600 mm, 83,0900 mm): Line on F.Silkscreen
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@(142,9238 mm, 83,1362 mm): Through hole pad 1 [V] of H2
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(139,6600 mm, 83,0900 mm): Line on F.Silkscreen
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@(146,6362 mm, 83,1362 mm): Through hole pad 1 [V] of H2
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(142,9300 mm, 83,0900 mm): Line on F.Silkscreen
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@(144,7800 mm, 81,2800 mm): Through hole pad 1 [V] of H2
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(142,9300 mm, 83,0900 mm): Line on F.Silkscreen
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@(142,9238 mm, 83,1362 mm): Through hole pad 1 [V] of H2
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(146,6310 mm, 83,0900 mm): Line on F.Silkscreen
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@(144,7800 mm, 81,2800 mm): Through hole pad 1 [V] of H2
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(146,6310 mm, 83,0900 mm): Line on F.Silkscreen
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@(146,6362 mm, 83,1362 mm): Through hole pad 1 [V] of H2
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(124,4200 mm, 84,6000 mm): Line on F.Silkscreen
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@(129,5400 mm, 81,2800 mm): Through hole pad 1 [U] of H1
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(127,6900 mm, 83,0900 mm): Line on F.Silkscreen
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@(129,5400 mm, 81,2800 mm): Through hole pad 1 [U] of H1
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(127,6900 mm, 83,0900 mm): Line on F.Silkscreen
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@(127,6838 mm, 83,1362 mm): Through hole pad 1 [U] of H1
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(131,3910 mm, 83,0900 mm): Line on F.Silkscreen
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@(129,5400 mm, 81,2800 mm): Through hole pad 1 [U] of H1
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(131,3910 mm, 83,0900 mm): Line on F.Silkscreen
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@(131,3962 mm, 83,1362 mm): Through hole pad 1 [U] of H1
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(124,4200 mm, 83,0900 mm): Line on F.Silkscreen
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@(129,5400 mm, 81,2800 mm): Through hole pad 1 [U] of H1
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(124,4200 mm, 83,0900 mm): Line on F.Silkscreen
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@(127,6838 mm, 83,1362 mm): Through hole pad 1 [U] of H1
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(124,4200 mm, 83,0900 mm): Line on F.Silkscreen
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@(131,3962 mm, 83,1362 mm): Through hole pad 1 [U] of H1
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(154,9000 mm, 83,0900 mm): Line on F.Silkscreen
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@(161,8762 mm, 83,1362 mm): Through hole pad 1 [W] of H3
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(154,9000 mm, 83,0900 mm): Line on F.Silkscreen
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@(160,0200 mm, 81,2800 mm): Through hole pad 1 [W] of H3
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(154,9000 mm, 83,0900 mm): Line on F.Silkscreen
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@(158,1638 mm, 83,1362 mm): Through hole pad 1 [W] of H3
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(154,9000 mm, 84,6000 mm): Line on F.Silkscreen
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@(160,0200 mm, 81,2800 mm): Through hole pad 1 [W] of H3
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(161,8710 mm, 83,0900 mm): Line on F.Silkscreen
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@(161,8762 mm, 83,1362 mm): Through hole pad 1 [W] of H3
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[silk_over_copper]: Silkscreen clipped by solder mask
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Rule: board setup constraints silk; Severity: warning
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@(161,8710 mm, 83,0900 mm): Line on F.Silkscreen
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@(160,0200 mm, 81,2800 mm): Through hole pad 1 [W] of H3
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** Found 0 unconnected pads **
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